Potting & Encapsulating Compounds
For Electronic Applications |
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| Products |
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| ENFIL
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:
General purpose PU potting compound for AC & DC capacitors |
| ENFIL LF
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: General purpose cost effective PU potting system |
| ENFIL HF
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: Softer PU potting system with good flexibility & low temperature crack
resistance |
| ENFIL FR |
: Flame retardant PU potting compounds available in V-0 & V-2 grades per
UL-94 specifications |
| ENCAST
100 |
: UL approved V0 grade. File no
QMFZ2-E248692 |
| ENCAP CJC |
: General purpose PU encapsulation compound for auto-electronic components |
| ENCAP PC |
: Flexible & transparent PU encapsulation compound for PCB
assemblies |
| EPOCAST
3123 |
: General purpose Epoxy potting compound |
| EPOCAST 231 |
: Flame retardant Epoxy compound in V-0 grade per UL-94 specifications |
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| Proven Applications |
- Potting and topping of AC & DC capacitors
- Potting of auto-electronic components such as flashers, blinkers, voltage regulators,
CDI units
- Encapsulation of Printed Circuit Boards
- Potting of transformers, coils, rectifiers
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